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JEDEC IC Trays for Dust Protection & Production Safety

JEDEC IC Trays for Dust Protection & Production Safety

Наименование марки: Hiner-pack
Номер модели: ХН25032
МОК: 500 шт.
цена: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Условия оплаты: Т/Т
Способность к поставкам: 2000 шт/день
Подробная информация
Место происхождения:
Китай
Сертификация:
ROHS, ISO
Вес подноса:
Варьируется, обычно до 500 грамм на полость
Цвет:
Черный
Гарантия качества:
Гарантия поставки, надежное качество
Размер полости:
322,6×135,9×7,5 мм
Инкотермс:
Exw, FOB, CIF, DDU, DDP
Тип пресс-формы:
Инъекция
Многоразовый:
Да
Форма подноса:
Прямоугольный
Чистый класс:
Общая и ультразвуковая чистка
Тип IC:
BGA,QFP,QFN,LGA,PGA
Уровень упаковки:
Транспортный пакет
Плоскостность:
Менее 0,74 мм
Емкость:
4X2=8 шт.
Упаковывая детали:
картон, поддон
Поставка способности:
2000 шт/день
Описание продукта
JEDEC IC Trays for Dust Protection & Production Safety
Shield delicate IC components from impact, dust, and misalignment during production. Built with heat-resistant MPPO material for long-lasting structural stability. Adhere to JEDEC standards for consistent industrial performance. Seeking reliable trays to keep components intact?

Integrate seamlessly with automated assembly lines and cleanroom workflows. Perform steadily in component loading, transfer, and packaging procedures. Adapt smoothly to diverse semiconductor manufacturing scenarios.

Support fully customized cavity shapes and grid layouts to match specific component dimensions. Prioritize clean production compatibility. Deliver tailored solutions that optimize manufacturing efficiency and protect ICs throughout transit.
Key Features/ Benefits 
  • Sturdy structural integrity
  • Effective dust prevention
  • Short delivery time and good quality.
  • Professional sales within 24 hours efficient reply.
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN25032
Material MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.5 mm
Cavity Size 64.64×49.84×1.65 mm
Matrix QTY 4X2=8 PCS
Warpage MAX 0.74mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Serve semiconductor IC assembly, cleanroom testing, component sorting, and precision storage operations. Compatible with automated handling systems, Class 100/1000 cleanrooms, and high-precision manufacturing lines.

Also utilized in inter-factory component transfer, overseas logistics shipping, and finished component warehousing. Cater to IC manufacturers, packaging houses, and electronic component logistics providers.
Customized Services
Provide fully customized solutions for JEDEC IC trays. Adjust cavity size, pitch, and layout to fit diverse component dimensions. 

Leverage durable MPPO material for enhanced stability. Offer prototype testing and personalized design support to meet unique production and packaging needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers