Процесс формирования вафли

Дисплей мастерской
October 07, 2023
Brief: Discover the WAFFLE PACK MOLD PROCESS for Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die. These anti-static JEDEC trays are designed for semiconductor packaging, offering reliable protection and convenience for small silicon dies. Ideal for MPW processes, these trays ensure safe transit and transport with customizable options.
Related Product Features:
  • Customized reusable waffle pack chip trays for wafer die, tailored to specific semiconductor designs.
  • Anti-static JEDEC trays with pockets matching die size, ensuring safe delivery of silicon dies.
  • Made from high-quality MPPO material, providing durability and protection for small components.
  • Available in various sizes (2", 3", 4") and customizable colors to meet diverse packaging needs.
  • Features a lid and anti-static bag for secure and safe transportation of wafer dies.
  • Ideal for MPW processes, offering a reliable solution for small batch production.
  • Complies with RoHS standards and ISO certification, ensuring high-quality and eco-friendly products.
  • Supports OEM and ODM services, with professional design and packaging solutions.
Вопросы:
  • Can you do OEM and customized design IC trays?
    Yes, we have strong mold manufacturing and product design capabilities, with extensive experience in mass production of various IC trays.
  • How long is your delivery time?
    Generally 5-8 working days, depending on the actual purchase quantity of orders.
  • Do you provide samples? Is it free or extra?
    Yes, we offer samples which may be free or charged based on product value, with shipping costs normally collected or as agreed.
  • What kind of Incoterms can you do?
    We support Ex works, FOB, CNF, CIF, CFR, DDU, DAP, and other incoterms as agreed.
  • What methods can you use to ship the goods?
    We ship by sea, air, express, or mail, depending on customer order quantity and volume.
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