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Precision JEDEC IC Trays Tailored For IC Chip Production In Semiconductor

Precision JEDEC IC Trays Tailored For IC Chip Production In Semiconductor

Наименование марки: Hiner-pack
Номер модели: ХН24139
МОК: 500pcs
цена: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Условия оплаты: 100% Prepayment
Способность к поставкам: 2000PCS/Day
Подробная информация
Место происхождения:
ШЭНЬЧЖЭНЬ КИТАЙ
Сертификация:
RoHS、ISO
Метод формования:
Литье под давлением
Температура:
80°К~180°К
Коробление:
Менее 0,76 мм
Прочный:
Да
Индивидуальный сервис:
Поддержка стандартных и нестандартных
Свойство:
ЭСР, без ЭСР
Штабелируемый:
Да
Антистатический:
Да
Packaging Details:
70~100pcs/carton(According To The Customer Demand)
Supply Ability:
2000PCS/Day
Выделить:

JEDEC IC trays for semiconductor

,

precision IC chip trays

,

JEDEC matrix trays with warranty

Описание продукта

Precision JEDEC IC Trays Tailored For IC Chip Production In Semiconductor


The High Precision JEDEC Matrix Tray is engineered to deliver exceptional dimensional accuracy and stability for semiconductor packaging and component handling. Designed to meet JEDEC global standards, it offers a reliable solution for transporting, testing, and storing delicate devices within automated environments. Each pocket maintains precise geometry, ensuring components stay aligned and protected during multi-step production flows. The tray’s ESD-safe material provides consistent anti-static performance while withstanding long-term use in cleanroom and production settings.

Features & Benefits:

High Dimensional Accuracy – Maintains tight tolerances across all pockets, ensuring reliable component positioning in high-speed automation.

Global JEDEC Compatibility – Fully compliant with JEDEC standards for smooth interchangeability across equipment and supply chains.

Static Dissipative Performance – Stable ESD protection prevents electrostatic damage to sensitive devices.

Smooth Pocket Surface – Minimizes friction and particle generation during automated loading and unloading.

Structural Integrity – Reinforced frame enhances tray rigidity and prevents warping under operational stress.

Stackable Design – Interlocking edges allow secure stacking for compact storage and efficient logistics.

Technical Parameters:

Brand Hiner-pack
Model HN24139
Material MPPO
Package Type IC Component
Color Black
Resistance 1.0x10e4-1.0x10e11Ω
Outline Line Size 322.6x135.9x12.19mm
Cavity Size 30.4x15.5x7.65mm
Matrix QTY 6*8=48PCS
Flatness MAX 0.76mm
Service Accept OEM, ODM
Certificate RoHS, IOS

Applications:

This tray is designed for high-precision manufacturing environments requiring consistent alignment and handling of small to medium-sized components. Typical uses include IC assembly, semiconductor module packaging, high-reliability testing, and device storage. It performs effectively under robotic transfer systems, pick-and-place machinery, and automated conveyors, supporting stable operation in cleanroom or standard production conditions.

Customization:

The High Precision JEDEC Matrix Tray can be customized for unique production demands and specialized device geometries:

Tailored Pocket Designs – Adjust pocket shape and depth to suit varied device outlines or thicknesses.

Color Customization – Available in multiple ESD-safe color variants to support line management and batch identification.

Integrated Identification – Include molded markings or embedded codes for traceability and process control.

Automation-Ready Enhancements – Optional edge and corner modifications ensure compatibility with proprietary automation interfaces or specialized robotic systems.